Description
IVES Lead-Free BGA Ball Mounting Flux Paste is a high-quality, lead-free solder paste that is ideal for mobile phone repair, chip planting, and electronic component soldering applications. It is made with a tin-silver-copper alloy and a rosin flux, which makes it easy to use and produces high-quality solder joints. The solder paste is also viscosity and graininess controlled, ensuring a consistent and reliable performance.
Features:
- Lead-free
- Tin-silver-copper alloy
- Rosin flux
- Easy to use
- Produces high-quality solder joints
- Viscosity and graininess controlled
- Ideal for BGA ball mounting, mobile phone repair, chip planting, and electronic component soldering applications
- Small size, easy to carry
Benefits:
- Repairs PCB circuit boards
- Solders electronic components
- Performs BGA welding
- Repairs mobile phones
- Easy to use
- Produces high-quality solder joints
- Consistent and reliable performance
- Portable and easy to carry
Applications:
- BGA ball mounting
- Mobile phone repair
- Chip planting
- Electronic component soldering
